|This Slide: #63 of 100|
Slide #63. Amkor Technology, Inc. — Toshiba Electronics Malaysia Sdn. Bhd.
Amkor Technology, Inc. (NASDAQ:AMKR)
Toshiba Electronics Malaysia Sdn. Bhd.
Toshiba Corporation (TOKYO: 6502) and Amkor Technology, Inc. (NASDAQ:,AMKR) today announced that the companies have completed Amkor's acquisition of Toshiba Electronics Malaysia Sdn. Bhd. ("TEM"), Toshiba's semiconductor packaging operation in Malaysia. The transaction also includes Toshiba's license to Amkor of related intellectual property rights and a manufacturing services agreement between Toshiba and Amkor.
Amkor Technology is a provider of outsourced semiconductor packaging and test services, which include semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. Co.'s Advanced Products include flip chip chip scale packages, wafer-level packages and flip chip ball grid array packages, while its Mainstream Products include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages. Co. provides its services to integrated device manufacturers, fabless semiconductor companies and contract foundries.
AMKR SEC Filing Email Alerts Service
Open the AMKR Page at The Online Investor »
Strong Sell (0.00 out of 4)