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Slide #63. Amkor Technology, Inc. — Toshiba Electronics Malaysia Sdn. Bhd.
Amkor Technology, Inc. (NASDAQ:AMKR)
Toshiba Electronics Malaysia Sdn. Bhd.
Toshiba Corporation (TOKYO: 6502) and Amkor Technology, Inc. (NASDAQ:,AMKR) today announced that the companies have completed Amkor's acquisition of Toshiba Electronics Malaysia Sdn. Bhd. ("TEM"), Toshiba's semiconductor packaging operation in Malaysia. The transaction also includes Toshiba's license to Amkor of related intellectual property rights and a manufacturing services agreement between Toshiba and Amkor.
Amkor Technology provides outsourced semiconductor packaging and test services. Co. provides packaging and test services including semiconductor wafer bump, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. Co. refers to its flip chip, wafer-level processing and related test services as Advanced Products, and its wirebond packaging and related test services as Mainstream Products. Co.'s Advanced Products include flip chip chip scale packages, wafer-level packages and flip chip ball grid array packages. Co.'s Mainstream Products include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.
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Strong Buy (4.00 out of 4)