Amkor Technology provides outsourced semiconductor packaging and test services. Co. provides packaging and test services including semiconductor wafer bump, wafer probe, packaging, system-level and final test and drop shipment services. Co. refers to its flip chip, wafer-level processing and related test services as Advanced Products, and its wirebond packaging, power device packaging and related test services as Mainstream Products. Co.'s Advanced Products include flip chip chip scale packages, wafer-level packages and flip chip ball grid array packages. Co.'s Mainstream Products include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.

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